Производители электронных компонентов /

NIC Components Corp

In 1982, NIC Components Corp. was licensed by Nippon Industries Co., Ltd., of Japan for the North American sales of its passive components. Nippon Industries was founded in 1975 by Yoshiharu Dangi and Gichu Sato with an initial investment into a small manufacturer of aluminum electrolytic capacitors. In the ensuing years, they continued to invest in small and medium-sized Asian makers of passive components. Nippon’s philosophy was to provide an export market to those independent factories in return for a long-term allocation. To further enhance this unique fab-less model, Nippon provided its suppliers with financing, engineering and access to high quality raw material suppliers. All of Nippon’s products were for export, and many of its customers initially were importers and distributors in both Europe and North America.

In 1982, Richard Schuster and several associates founded NIC Components Corp. NIC, headquartered in Farmingdale, New York, set up sales and marketing in the United States and Canada and procured mot of its product from Nippon Industries. Some of its early distributors included Future Electronics, Belford, Bell (now Arrow) and Brevan. In 1989, NIC opened its second sales and warehouse facility in San Jose, California. While the core business remained in aluminum electrolytics, new fabs manufacturing tantalum, film and ceramic capacitors were recruited to round out the package of passive components. NIC also ventured into the resistive and magnetic component markets with Nippon’s new fab liaisons. In 1997, NIC Eurotech Ltd. was established in the United Kingdom as a wholly-owned subsidiary, and in 1999, NIC Components Asia PTE Ltd. was established in association with Nippon Industries and local management in Singapore. Today, NIC Components is approaching 200 million dollars in sales and has several thousand active customers worldwide, including top tier CEMs and OEMs.

Aluminum Electrolytic Capacitors
NIC’s original product line encompassed through-hole construction in axial, radial and snap mount configurations. Most of the product was produced in Japan, but due to labor costs and exchange rate considerations, some production was moved to Taiwan and China, in the late 80’s. Raw material and engineering were still predominantly Japanese in order to assure quality and uniformity.

In the mid-80’s, NIC introduced surface mount cylindrical can aluminum electrolytics to the U.S. market. At first the going was slow, with designs coming primarily from the larger, more progressive OEMs. Surface mount was still relatively new and the larger size aluminums presented some challenges for the pick-and-place equipment. Sizes were not yet standardized, and both CV and characteristics were somewhat limited. Still, NIC had resolved that this was the technology of the future, as was evident from the rapid evolution of though-hole to surface mount in other passive components such as ceramic and tantalum capacitors and discrete resistors. Using both through-hole and surface mount components on the same PCB must utilize two soldering processes, which is very costly. Aluminum electrolytics in surface mount packages have only taken off in the last few years, and now they are truly coming into popularity. Expansive ranges of size, capacitance, voltage and special characteristics such as low ESR, extended temperature and low leakage current offer a multitude of design options.

Due to NIC’s early entry into this technology and the fact that they have the most extensive line of surface mount types, they have established a very strong market position. They are now shipping over 40 million pieces per month, and this number is growing at a frenetic pace.

Сайт производителя: http://niccomp.com/